IC PACKAGING :

FOOTPRINT:

Footprint refers to the physical layout that is required on the printed circuit board in order to mount a component or physical attachment.

SOCKET:

Socket is nothing but attachment the printed circuit board 

PACKAGING:

Final stage in semiconductor device fabrication or simply device assembly.

 

TYPES OF PACKAGES:

• Surface mount package.
  
• Through hole package.
  
• Contactless Packages.        
  

                            

Surface Mount Package:

Surface mount package is the IC packaging technique, in which the compounds are mounted on the Printed Circuit Board(PCB).Devices mounted on this technique are called Surface Mounted Devices(SMD).Technique is called Surface Mount Technique(SMT).

TYPES OF SMT:

There are different types SMD packagings, but in this we are seeing only few. Based on the materials

• Ceramic
  
• Plastic
  
• Metal
  

 

 

 

QFP (Quad Flat Package) is a type of SMT having leads on the four sides.

 

Many versions of QFP are there, in this LQFP and TQFP are very special.LQFP stands for low profile QFP with leads on four sides ,numbering can done from anti clockwise from the point on the IC with pin spacing range from 0.4mm to 0.8mm.TQFP stands for Thin Quad Flat Package same as that of the QFP,with thin body(1.0mm)and have a standard lead footprint(2.0mm).

 

                LQFP                            TQFP            

SOIC(Small-Outline Integrated Circuit) is type of surface mount package with space requirement and thickness less than DIP(Dual In-line Package).                                                                        

 

 

THROUGH HOLE PACKAGE:

Through Hole is mounting scheme for electronic component that involves the use leads in the component.It provide a stronge mechanical bond when compared to surface mount.

 

 

 

There are different kinds of through hole package. DIP(Dual In-line Package) is a through hole package in which circuits can be packed densely compared to round packages.